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back grinding machines in semiconductor

Wafer grinding also called wafer thinning is a process performed during the semiconductor manufacturing to reduce wafer thickness This manufacturing step is essential in producing the ultrathin wafers required for stacking and highdensity packaging in portable and handheld devices

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  • Coal Crushing Plant in Russia

    Coal Crushing Plant in Russia

    Purchasing equipment: mobile crushing station with models of FTM938E69 and FTM935F1214L as well as belt conveyor with types of B800×10m, B800×12m, B800×14m, B800×18m and B650×15m.

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  • Chrome Ore Processing Plant

    Chrome Ore Processing Plant

    Gravity separation is the main beneficiation method of chrome ore, and the equipment is jigger, shaking table, spiral classifier, centrifugal concentrator and spiral chute, etc. Sometimes it will also use weak magnetic separation or strong magnetic separa

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  • 100Th Limestone Crushing Line In Switzerland

    100Th Limestone Crushing Line In Switzerland

    Main Equipments: PE series jaw crusher, impact crusher, sand maker, raymond grinding mill, vibrating screen and vibrating feeder.

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  • Basalt Sand Making Plant in Philippines

    Basalt Sand Making Plant in Philippines

    In accordance with the field visit of working site and technical guidance, Fote Machinery introduced 3 stages crushing process for our customer.

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  • Ilmenite Ore Beneficiation Plant

    Ilmenite Ore Beneficiation Plant

    For Ilmenite beneficiation, a combined beneficiation method is often better than a single beneficiation method, which can better improve the ore grade and recovery rate. At present, the combined separation method for ilmenite can be divided into four kind

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  • Basalt Crushing Plant

    Basalt Crushing Plant

    Basalt is the best material for repairing roads, railways and airfield runways. It has the advantages of abrasion resistance, less water consumption, poor conductivity, strong compressive strength, low crushing value, strong corrosion resistance and asp

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  • Semiconductor BackGrinding

    Semiconductor BackGrinding

    Semiconductor BackGrinding The silicon wafer on which the active elements are created is a thin circular disc typically 150mm or 200mm in diameter During diffusion and similar processes the wafer may become bowed but wafers for assembly are normally stress relieved and can be regarded as flat

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  • Wholesale Semiconductor Back Grinding  Semiconductor

    Wholesale Semiconductor Back Grinding Semiconductor

    EC21 is the largest global B2B marketplace Global semiconductor back grinding buyers find suppliers here every day If you are a manufacturer or supplier who want more international buyers join EC21 for free now and get your products listed here

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  • Wafer Backgrind  All About Semiconductor Manufacturing

    Wafer Backgrind All About Semiconductor Manufacturing

    The machine picks up the wafer from its backside untaped side with a robotic arm which positions the wafer for backgrinding The backgrinding process is automatically accomplished by a grinding wheel following a precise set of parameters to ensure proper backgrinding

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  • Grinding Machine for Semiconductor Wafers

    Grinding Machine for Semiconductor Wafers

    Grinding Machines for Semiconductor Wafers Koyo Machine Industries developed several types of grinding machines used in the semiconductor industry for silicon wafer manufacturing and IC production Vertical and horizontal spindle systems are used in combination with special designed diamond grinding wheels that cut just at the edge of the rinding wheel resulting in high grinding

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  • The backend process Step 3 – Wafer backgrinding  Solid

    The backend process Step 3 – Wafer backgrinding Solid

    To increase productivity many equipment manufacturers produce equipment for thinning and handling of multiple wafers The designs of these machines affect the quality of the thinned wafers as much as the selection of the grinding spindles Figure 4 shows schematic representations of some multiwafer handling machines that are available today

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  • Wholesale Semiconductor Back Grinding  Semiconductor Back

    Wholesale Semiconductor Back Grinding Semiconductor Back

    This page is your semiconductor back grinding onestop source for the competitive prices and quality from sewing machine suppliers and manufacturers If you have a difficulty finding a right supplier post your Buying Leads for FREE now

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  • Wafer Backgrind  All About Semiconductor Manufacturing

    Wafer Backgrind All About Semiconductor Manufacturing

    Wafer Backgrind Wafer Backgrind is the process of grinding the backside of the wafer to the correct wafer thickness prior to assembly It is also referred to as wafer thinning Wafer backgrinding has not always been necessary but the drive to make packages thinner and thinner has made it indispensable

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  • The backend process Step 3 – Wafer backgrinding  Solid

    The backend process Step 3 – Wafer backgrinding Solid

    With a 2000 grit grinding process the stress required to break the die was 50 percent higher than the stress needed to break a die with a larger 1200 grit grinding process Figure 2 shows the method of applying the test force to the die and Figure 3 shows the difference in the scratches on the wafers using different grits to grind the silicon

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  • Wafer Grinder Finishing  Grinding Machines  Koyo

    Wafer Grinder Finishing Grinding Machines Koyo

    Industry Information TechnologySemiconductor Grinding CapacityLapping capacity Ø200 – Ø300mm Description Simultaneously grinding both faces of Silicon Wafers with a throughput of 90 seconds for 300mm diameter wafers

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  • Wafer Back Grinding  네이버 블로그

    Wafer Back Grinding 네이버 블로그

    Semiconductor backgrinding The grinding process Reducing stresses and flaws The silicon wafer on which the active elements are created is a thin circular disc typically 150mm or 200mm in diameter During diffusion and similar processes the wafer may become bowed but wafers for assembly are normally stress relieved and can be regarded as

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  • China Back Grinding Machine for 12 Wafer  China Wafer

    China Back Grinding Machine for 12 Wafer China Wafer

    Wafer Grinder Wafer Grinding Machine Back Grinder manufacturer supplier in China offering Back Grinding Machine for 12 Wafer New Design CNC Laser Tin Soldering Robot for FFC FPC Fine Connector Pcbs New Design CNC Laser Tin Soldering Robot

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  • AdwillSemiconductorrelated Products  LINTEC Corporation

    AdwillSemiconductorrelated Products LINTEC Corporation

    The LINTEC Adwill series includes UV curable dicing tapes high performance back grinding tapes dicing die bonding tapes required for semiconductor packaging and backside coating tapes Adwill continues to make steady progress in the advancement of related equipment and unique systems

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  • Semiconductor Manufacturing Equipment

    Semiconductor Manufacturing Equipment

    Probing machines perform electrical tests of each chip on a wafer ensuring the quality of semiconductor devices Polish Grinders Polish grinders simultaneously thin wafers while performing damage removal caused by the grinding process and offer various applications for peripheral processes in the one system

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  • Surface  Meister Abrasives AG Andelfingen CH

    Surface Meister Abrasives AG Andelfingen CH

    Meister Abrasives diamond back grinding wheels are used to process silicon wafers and compound semiconductor materials GaAs Ge SiC GaN AlN etc to the thinnest thickness at lowest TTV The low force diamond wheels improve the process quality by reducing sub surface damage and chipping

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  • Back Grinding Wheels for Silicon Wafer

    Back Grinding Wheels for Silicon Wafer

    Back Grinding wheel Application of back grinding wheels back thinning grinding and fine grinding of apphire epitaxial wafer silicon wafer gallium arsenide and GaN wafer Grinding Machines Okamoto Disco TSK and STRASBAUGH etc Bonded Vitrified bond Resin bond Diameter mm D175 D195 D209 D305 D335 etc Manufacturing Processes for Silicon Wafers Ingot cropping Peripheral

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  • Silicon Back Grinding  Products  Suppliers  Engineering360

    Silicon Back Grinding Products Suppliers Engineering360

    Find Silicon Back Grinding related suppliers manufacturers products and specifications on GlobalSpec a trusted source of Silicon Back Grinding information making it an ideal and economi­cal choice for use as a glass polishing substrate for the thinning process back grinding of semiconductor chips supporting low Grinders and

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  • Grinding Machines  Products  Komatsu NTC Ltd

    Grinding Machines Products Komatsu NTC Ltd

    Fukuno Plant 641 Nojiri Nanto City Toyama 9391502 Japan Tel 81763222165 Fax 81763226218

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  • Grinding of silicon wafers A review from historical

    Grinding of silicon wafers A review from historical

    certain thickness 32 Generally back grinding is more costeffective than alternative thinning processes such as wet etching 3334 and plasma etching 3536 In back grinding the removal amount is typically a few hundred microns in wafer thickness Usually back grinding is carried out in two steps coarse grinding and fine grinding

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  • Products for Back Grinding Process  AdwillSemiconductor

    Products for Back Grinding Process AdwillSemiconductor

    Leadingedge Tape × Equipment solution created with semiconductorrelated products Adwill Products that contribute to back grinding processes such as back grinding tape laminators and removers etc

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  • Surface  Meister Abrasives AG Andelfingen CH

    Surface Meister Abrasives AG Andelfingen CH

    Meister Abrasives diamond back grinding wheels are used to process silicon wafers and compound semiconductor materials GaAs Ge SiC GaN AlN etc to the thinnest thickness at lowest TTV The low force diamond wheels improve the process quality by reducing sub surface damage and chipping

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  • Disco Back Grinding Machines  Products  Suppliers

    Disco Back Grinding Machines Products Suppliers

    After removing the PR figure 3r the wafer was thinned to 450μm using a backside grinding machine and the throughsubstrate slots were exposed to the back of the wafer after a dicing process was completed using a dicing machine DFD 6361 from DISCO Corporation Japan figure 3

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  • AM TECHNOLOGY  Back Grinding Machine P  L Division

    AM TECHNOLOGY Back Grinding Machine P L Division

    Korean machine industry platform Komachine introduces AM TECHNOLOGY Back Grinding Machine P L Division DG Division Laser Division Manufacturer of Fine grinding Dicing Wrapping Polishing Slicing Slot grinding MC Semiconductor

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  • Wafer Frontside Taping Machineid887164 Buy

    Wafer Frontside Taping Machineid887164 Buy

    There are 11 Semiconductor Back Grinding from 8 suppliers on Related Searches machine machinery oil purifier filter hardware cutting machine oil recycling oil filter

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  • Protection Tape Remover for Backgrinding Process NEL

    Protection Tape Remover for Backgrinding Process NEL

    Fullauto type Semiauto type machines are lined up and large size wafers are also available Protection Tape Remover from TAIKO Wafer NEL SYSTEM series This equipment is fullauto type Tape remover removes protection tape for backgrinding process from TAIKO wafer patterned surface

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  • Polish Grinders|Semiconductor Manufacturing Equipment

    Polish Grinders|Semiconductor Manufacturing Equipment

    Semiconductor Manufacturing Equipment Polish Grinders Polish grinders simultaneously thin wafers while performing damage removal caused by the grinding process and offer various applications for peripheral processes in the one system

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  • Introduction to Semico nductor Manufacturing and FA

    Introduction to Semico nductor Manufacturing and FA

    Back EndBE Process Wafer Back Grinding • The typical wafer supplied from ‘wafer fab’ is 600 to 750μm thick • Wafer thinned down to the required thickness 50um to 75um by abrasive grinding wheel › 1st step Use a large grit to coarsely grind the wafer and remove the bulk of the excess wafer thickness

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  • Grinding of silicon wafers A review from historical

    Grinding of silicon wafers A review from historical

    certain thickness 32 Generally back grinding is more costeffective than alternative thinning processes such as wet etching 3334 and plasma etching 3536 In back grinding the removal amount is typically a few hundred microns in wafer thickness Usually back grinding is carried out in two steps coarse grinding and fine grinding

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  • Fine grinding of silicon wafers  Kansas State University

    Fine grinding of silicon wafers Kansas State University

    International Journal of Machine Tools Manufacture 41 2001 659–672 Fine grinding of silicon wafers ZJ Pei a Alan Strasbaugh b a Department of Industrial and Manufacturing Systems Kansas State University Manhattan KS 66506 USA b Strasbaugh Inc 825 Buckley Road San Luis Obispo CA 93401 USA Received 17 November 1999 accepted 5 October 2000

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  • DISCO precision machines  dicinggrinding service

    DISCO precision machines dicinggrinding service

    Best Equipment for advanced DicingGrinding Service DISCO’s highquality precision technology guarantees excellent processing results Manufactured at the Kuwabata Plant in Hiroshima Prefecture DISCO’s precision dicing saws and grindingpolishing machines combined with etchers surface planers and AOI tools offer customers the highest level of quality

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  • Release of new model back grinding tape laminator  News

    Release of new model back grinding tape laminator News

    Apr 28 2017 · Back Grinding Tape Laminator “RAD3520F12” Improved performance in anticipation of new semiconductor demand for cuttingedge devices and IoT LINTEC develops and provides a tape laminator to protect the circuit surface of the wafer during the back grinding and thinning process of the semiconductor wafer after circuit formation

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  • Silicon Back Grinding  Products  Suppliers  Engineering360

    Silicon Back Grinding Products Suppliers Engineering360

    Description coating are durable enough that the paper stays intact during the grinding stage that the abrasive does not contain over size particles and that PSA backed papers are easily removed from the platen after use with no glue residue left n carbide grinding Abrasive Grain Material Type Silicon Carbide Applications Blending Intermediate Cutting Medium Grits

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  • Back Grinding Wheel For Silicon Wafer  Buy Back Grinding

    Back Grinding Wheel For Silicon Wafer Buy Back Grinding

    Back Grinding Wheel For Silicon Wafer Find Complete Details about Back Grinding Wheel For Silicon WaferBack Grinding Wheel For SiliconChina Grinding WheelAbrasive Grinding Wheel For Semiconductor Materials from Grinding Wheels Supplier or

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